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Canada-QC-ROSEMERE Azienda Directories
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Azienda News:
- Surface Engineering and Patterning Using Parylene for Biological . . .
Due to the low sticking coefficient (<1 × 10-3) at room temperature , parylene is known for its excellent conformal coating of the substrate, even trenches, which is highly attractive for coating biomedical stents
- SCS PARYLENE PROPERTIES - Rutgers University
the series, Parylene N, is poly(para-xylylene), a completely linear, highly crystalline material Parylene N is a primary dielectric, exhibiting a very low dissipation factor, high dielectric strength, and a low dielectric constant invariant with frequency The crevice-penetrating ability of Parylene N is second only to that of Parylene HT
- Modeling of the CVD Deposition Process for Parylene-C to Predict Thin . . .
monly known as the ”sticking coefficient” of the gas Its value depends on the energetics of the reaction at the sur-face sites and is typically dependent on the temperature of the surface The sticking coefficient for p-xylylene is low, generally on the order of between 1,000 and 10,000 [7] In many cases this is ideal as it allows p
- 4. 6. Sticking Coefficients - ansyshelp. ansys. com
For some simple surface reaction mechanisms we have found it convenient to specify the surface reaction rate constant in terms of a "sticking coefficient" (probability), rather than an actual reaction rate
- SCS PARYLENE PROPERTIES - University of Florida
Parylene N has superior dielectric properties, exhibiting very low values for dielectric constant and dissipation factor that are invariant with frequency The ability of Parylene N to coat in and around tight spaces is second only to that of Parylene HT® The Parylene structures are shown in Figure 1
- Conformal Coating Application Guide - Advanced Coating
The coefficients of thermal expansion of the parylenes are similar to epoxies: approximately 35 ppm degrees C vs 27 to 30 ppm degrees C for most epoxy molding compounds
- Di-para-xylylene - Big Chemical Encyclopedia
This process involves subjecting di-para-xylylene (or a substituted version) to high temperature in a high-vacuum chamber The di-para-xylylene forms a di-radical that polymerizes and uniformly coats all surfaces in the vacuum chamber
- REVIEW - J-STAGE
Di-p-xylylene is not only very stable under ambient conditions, but it also decomposes at relatively low pyrolysis temperatures (600–650°C, compared to 900–1000°C for p-xylene) with a quantitative formation of p-xylylene Both these features enabled commerciali-zation of the process, developed by W F Gorham of the
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